Passive Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

IBM PureFlex Systems with VMWare: Cloud-ready virtualization with the flexibility of an expert integrated system
sponsored by IBM
WHITE PAPER: This resource explores the benefits of combining IBM PureFlex System with VMware. Inside, discover how you can implement a reliable cloud-ready infrastructure with integrated hardware and software designed for efficient virtualization. Discover if this combination will bring the benefits your organization needs.
Posted: 15 Jul 2013 | Published: 30 Apr 2012

IBM

PowerEdge M1000e Blade Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this concise white paper to find out the key features of this blade chassis that will help you construct your IT infrastructure, as well as a complete list of its technical specifications.
Posted: 19 Feb 2014 | Published: 31 Dec 2013

Dell, Inc. and Intel®

Dell: Expanding Its Position as an HPC Market Leader
sponsored by Dell, Inc. and Intel®
WHITE PAPER: With several offerings available, choosing the ideal high performance computing (HPC) offering for your business can be a daunting task. This resource examines one well-reputed HPC vendor and explains how it differentiates itself in the competitive marketplace.
Posted: 02 Apr 2012 | Published: 01 Apr 2011

Dell, Inc. and Intel®

Running SAP NetWeaver on the Oracle Exalogic Elastic Cloud: An Architectural Overview
sponsored by Oracle Corporation
WHITE PAPER: This white paper underscores the importance of a cohesive SAP infrastructure. Explore a recommended architecture and the process involved in implementing it.
Posted: 02 Aug 2012 | Published: 01 Sep 2011

Oracle Corporation

Imaging a Latitude 10 on Windows 8 with System Center Configuration Manager
sponsored by DellEMC and Intel®
WHITE PAPER: Check out this exclusive white paper for directions on how to create a Windows 8 image for the Latitude 10, as well as the information you need to image a Latitude 10 in your enterprise environment.
Posted: 07 Mar 2014 | Published: 31 Dec 2010

DellEMC and Intel®